ParaBond Adhesive is a chemical curing, self-conditioning Adhesive System for enamel and dentin. It consists of a Non-Rinse Conditioner and a chemical-curing adhesive (Adhesive A and B). Instead of the None-Rinse Conditioner also phosphoric acid can be used.
- seals the tooth surface and minimizes the risk of postoperative sensitivities
- ideal for situations where light might not penetrate, such as for post cementation, metal crowns, deep cavities or opaque ceramic
- high shear bond strengths on dentine and enamel
- universally applicable with chemically-, dual- and light-curing materials
Refill includes: 3 ml no-rinse conditioner.
Coltene ParaBond Instructions for Use
Coltene's SDS Gate for ParaBond Adhesives
- seals the tooth surface and minimizes the risk of postoperative sensitivities
- ideal for situations where light might not penetrate, such as for post cementation, metal crowns, deep cavities or opaque ceramic
- high shear bond strengths on dentine and enamel
- universally applicable with chemically-, dual- and light-curing materials
Refill includes: 3 ml no-rinse conditioner.
Coltene ParaBond Instructions for Use
Coltene's SDS Gate for ParaBond Adhesives
